Find your material below to learn more about our processes and chemistry for medical implant devices.
Process Step | Product | Description |
---|---|---|
Step 1: Pre-Clean | MicroClean™ Ti | Degreaser+, designed to remove soils that could interfere with subsequent processes |
Step 2: Deoxidize | Ti Pickling Solution™ | Mildly acidic, free of hydrofluoric acid |
Step 2: Deoxidize | MicroClean™ EV3 | Strongly acidic, free of hydrofluoric acid |
Step 2: Deoxidize | MicroClean™ BS | Strongly acidic, with hydrofluoric acid |
Step 2: Deoxidize | MicroPolish™ | Strongly acidic, with hydrofluoric acid, inhibited, mild polishing action, relatively more aggressive |
Step 2: Deoxidize | MicroClean™ 2160 | Moderately acidic, free of hydrofluoric acid |
Step 2: Deoxidize | MicroClean™ 2151 | Moderately acidic, free of hydrofluoric acid |
Step 2: Deoxidize | MicroPolish™ II | Strongly acidic, with hydrofluoric acid, inhibited, mild polishing action, relatively less aggressive |
Step 2: Deoxidize | MicroClean™ MV | Strongly acidic, with hydrofluoric acid, inhibited, more aggressive |
Step 2: Deoxidize, test | MicroClean™ 2150 | Moderately acidic, free of hydrofluoric acid |
Step 3: Electropolish | ElectroPolish NF™ | Room temperature electropolishing chemistry, organic |
Step 3: Electropolish | Nitinol ElectroPolish™ | Standard electropolish containing 70% Methanol/30% Sulfuric Acid; this product requires cooling to very low temperatures |
Step 3: Electropolish | ElectroPolish Ti2™ | Room temperature electropolishing chemistry, organic |
Step 3: Electropolish | ElectroPolish 2152 | Electropolish for Titanium and Titanium Alloys |
Process Step | Product | Description |
---|---|---|
Step 1: Pre-Clean | MicroClean™ Ti | Degreaser+, designed to remove soils that could interfere with subsequent processes |
Step 2: Deoxidize | MicroClean™ 2160 | Moderately acidic, free of hydrofluoric acid |
Step 2: Deoxidize | MicroClean™ 2151 | Moderately acidic, free of hydrofluoric acid |
Step 2: Deoxidize, test | MicroClean™ 2150 | Moderately acidic, free of hydrofluoric acid |
Step 2: Deoxidize | ChemPolish Ti6Al4V™ | Strongly acidic, with hydrofluoric acid, inhibited |
Step 3: Electropolish | ElectroPolish NF™ | Room temperature electropolishing chemistry, organic |
Step 3: Electropolish | ElectroPolish Ti2™ | Room temperature electropolishing chemistry, organic |
Step 3: Electropolish | ElectroPolish 2152 | Electropolish for Titanium and Titanium Alloys |
Process Step | Product | Description |
---|---|---|
Step 1: Pre-Clean | MicroClean™ Ti | Degreaser+, designed to remove soils that could interfere with subsequent processes |
Step 2: Deoxidize | CoCr Cleaner™ | Strongly acidic, for light oxide |
Step 2: Deoxidize | CoCr Cleaner™ II | |
Step 2: Deoxidize | Alkaline Descale™ | A strongly oxidizing surface conditioner designed to descale cobalt/chromium and other chromium based alloys before chemical polishing or electropolishing |
Step 2: Deoxidize | Descale Remover™ | An acidic chemistry that removes smut and residual metal oxide solubilized by Aklaline Descale |
Step 3: Electropolish | CoCr Electropolish | Acidic electropolish chemistry |
Process Step | Product | Description |
---|---|---|
Step 1: Pre-Clean | MicroClean™ Ti | Degreaser+, designed to remove soils that could interfere with subsequent processes |
Step 2: Clean | ChemPolish™ RL | Acidic chemistry for cleaning, polishing and passivating 300 series stainless steel |
Step 2: Clean | ChemPolish™ SS | Acidic chemistry for polishing and passivating 300 series stainless steel |
Step 3: Electropolish | ElectroPolish 4000™ | |
Step 3: Electropolish | ElectroPolish 5000™ | Acidic electropolish chemistry |
Product | Description |
---|---|
M-Strip™ | Peroxide-Based Tin/Lead Stripper |
Magnum™ NPS-220 and Magnum™ NPS-240 | Two Step, Non-Peroxide Solder Stripper |
Select Strip™ Plus | Whole panel stripper |
NPS™ 3000 | Single Step Tin Stripper |
NPS™ 3001 | Single Step Tin Stripper |
NPS™ 3002 | Enhanced Single Step Tin Stripper |
NPS™10 & 20 | Non-Peroxide Tin/Lead Stripper |
Product | Description |
---|---|
Aspect | Organic Solderability Preservative |
Chemposit Sn | Immersion tin |
Product | Description |
---|---|
Acti Flo | HAL flux |
291 Flux | HAL flux |
Board Brite II | Acid cleaner for tin |
Solder Conditioner 417 | Acid cleaner for tin |
Thermo Flo™ | Water-soluble fusing fluid |
Quench Aide™ 96 | Rinse agent |
Rinse Aide™ 90 | Cleaner |
Rinse Aide™ 95 | Cleaner |
LevelCote™ Cover Oil 300 | Solder blanket oil for HAL |
LevelCote™ Flux 350 | HAL flux |
Flo Rite™ 60 | HAL flux |
Flo Rite™ LV | HAL flux |
Product | Description |
---|---|
Pure Isopropyl Alcohol | colorless, flammable liquid with a characteristic alcohol odor |
Acidified Pumice | An Acidified Pumice Scrub |
Copper Sulfate Solution | Uses only sulfuric acid and pure copper metal |
Hydrochloric Acid 20 Be | Etching Solution |
Sulfuric Acid 93% PC Grade | PC (Printed Circuit) grade Sulfuric Acid |
Product | Description |
---|---|
MetalTreat Chelate Eliminator-8 | Wastewater Treatment Chemical Formulation |
Metaltreat 529 | Heavy metal precipitant |
Metaltreat 528 Coagulant | Alternative to DTC Carbamate-type Products |
Metaltreat 513 | Heavy metal precipitant for wastewater treatment |
Metaltreat 510 | Ferrous Chloride based heavy metal precipitant |
Metaltreat 4007 | Wastewater treat coagulant |
Metaltreat AF 13-10 | Silicone based antifoam for waste treatment application |
Metaltreat 958 Flocculant | Unique high charge cationic flocculant |
Metaltreat 957 | Anionic Polymer Wastewater Flocculant |
Metaltreat 530 | Heavy metal precipitant |
Resist Treat 5000 | Wastewater coagulant/precipitant |